5nm及以上的垂直器件架构:器件和电路的影响

A. Thean, D. Yakimets, T. Huynh Bao, P. Schuddinck, S. Sakhare, M. Bardon, A. Sibaja-Hernandez, I. Ciofi, G. Eneman, A. Veloso, J. Ryckaert, P. Raghavan, A. Mercha, A. Mocuta, Z. Tokei, D. Verkest, P. Wambacq, K. De Meyer, N. Collaert
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引用次数: 40

摘要

垂直纳米线逻辑电路可以使器件密度扩展远远超出受栅极和触点放置限制的横向CMOS布局。在本文中,我们比较了垂直(vfet)栅极全能(GAA)晶体管与横向(lfet)瞄准5nm之间的性能,布局效率,SRAM设计和寄生。我们回顾了VFET器件和电路影响的一些独特考虑因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Vertical device architecture for 5nm and beyond: Device & circuit implications
Vertical nanowire logic circuits may enable device density scaling well beyond lateral CMOS layouts limited by gate and contact placement. In this paper, we compared the performance, layout efficiency, SRAM design, and parasitics between vertical (VFETs) gate-all-around (GAA) transistors with lateral (LFETs) targeting 5nm. We reviewed some of the unique considerations of VFET device and circuit influences.
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