{"title":"芯片封装板协同设计中改进可达性的接口优化","authors":"T. Meister, J. Lienig, Gisbert Thomke","doi":"10.1109/SLIP.2011.6135430","DOIUrl":null,"url":null,"abstract":"The simultaneous optimization of both pin assignment and pin routing for different hierarchy levels (chip, package, board) of an electronic system is a bottleneck in today's hierarchical co-design flows, typically requiring manual optimization strategies and multiple iterations. Specifically, a fast and finegrained evaluation of routability that considers all requirements between the different hierarchy levels is missing. In this paper we provide a comprehensive, fast method to evaluate the routability of interfaces in hierarchical systems based on a new probabilistic routability prediction. We implemented our methodology in an industrial design flow and achieved significant improvement in overall routing, including reduced manufacturing costs of chip-package-board co-designs.","PeriodicalId":189723,"journal":{"name":"International Workshop on System Level Interconnect Prediction","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Interface optimization for improved routability in chip-package-board co-design\",\"authors\":\"T. Meister, J. Lienig, Gisbert Thomke\",\"doi\":\"10.1109/SLIP.2011.6135430\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The simultaneous optimization of both pin assignment and pin routing for different hierarchy levels (chip, package, board) of an electronic system is a bottleneck in today's hierarchical co-design flows, typically requiring manual optimization strategies and multiple iterations. Specifically, a fast and finegrained evaluation of routability that considers all requirements between the different hierarchy levels is missing. In this paper we provide a comprehensive, fast method to evaluate the routability of interfaces in hierarchical systems based on a new probabilistic routability prediction. We implemented our methodology in an industrial design flow and achieved significant improvement in overall routing, including reduced manufacturing costs of chip-package-board co-designs.\",\"PeriodicalId\":189723,\"journal\":{\"name\":\"International Workshop on System Level Interconnect Prediction\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-06-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Workshop on System Level Interconnect Prediction\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SLIP.2011.6135430\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Workshop on System Level Interconnect Prediction","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SLIP.2011.6135430","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interface optimization for improved routability in chip-package-board co-design
The simultaneous optimization of both pin assignment and pin routing for different hierarchy levels (chip, package, board) of an electronic system is a bottleneck in today's hierarchical co-design flows, typically requiring manual optimization strategies and multiple iterations. Specifically, a fast and finegrained evaluation of routability that considers all requirements between the different hierarchy levels is missing. In this paper we provide a comprehensive, fast method to evaluate the routability of interfaces in hierarchical systems based on a new probabilistic routability prediction. We implemented our methodology in an industrial design flow and achieved significant improvement in overall routing, including reduced manufacturing costs of chip-package-board co-designs.