键合线连接引起的阻抗变化对信号传输的影响

2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course (HLM) Pub Date : 2020-09-30 DOI:10.1109/HLM49214.2020.9307856

Ziren Wang, G. Flowers, Jinchun Gao, Zekun Wang, Kaixuan Song

{"title":"键合线连接引起的阻抗变化对信号传输的影响","authors":"Ziren Wang, G. Flowers, Jinchun Gao, Zekun Wang, Kaixuan Song","doi":"10.1109/HLM49214.2020.9307856","DOIUrl":null,"url":null,"abstract":"Bonding wires are widely used in microwave circuits and chip packaging. Due to the high frequency of signals transmitted by modern communication circuits, any structural discontinuity may cause signal reflection. Bonding wires are one potential source of such effects and their impact on signal transmission performance is examined in this study. In the present work, based on the size and material characteristics of a sample circuit board with bonding wires, a 3D electromagnetic numerical calculation model was developed. The voltage standing wave ratio for various numbers of bonding wires between two connection points was studied. In addition, a corresponding circuit model was developed and the equivalent inductance for different numbers of bonding wires was calculated. Both the electromagnetic field model and the circuit model results were validated using experimental tests. Using these models, the impact of impedance changes resulting from different numbers of bonding wires on the integrity of both analog and digital signals was analyzed.","PeriodicalId":268345,"journal":{"name":"2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course (HLM)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Impact of Impedance Change Caused by Bonding Wire Connection on Signal Transmission\",\"authors\":\"Ziren Wang, G. Flowers, Jinchun Gao, Zekun Wang, Kaixuan Song\",\"doi\":\"10.1109/HLM49214.2020.9307856\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Bonding wires are widely used in microwave circuits and chip packaging. Due to the high frequency of signals transmitted by modern communication circuits, any structural discontinuity may cause signal reflection. Bonding wires are one potential source of such effects and their impact on signal transmission performance is examined in this study. In the present work, based on the size and material characteristics of a sample circuit board with bonding wires, a 3D electromagnetic numerical calculation model was developed. The voltage standing wave ratio for various numbers of bonding wires between two connection points was studied. In addition, a corresponding circuit model was developed and the equivalent inductance for different numbers of bonding wires was calculated. Both the electromagnetic field model and the circuit model results were validated using experimental tests. Using these models, the impact of impedance changes resulting from different numbers of bonding wires on the integrity of both analog and digital signals was analyzed.\",\"PeriodicalId\":268345,\"journal\":{\"name\":\"2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course (HLM)\",\"volume\":\"95 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-09-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course (HLM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HLM49214.2020.9307856\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course (HLM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HLM49214.2020.9307856","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

键合线广泛应用于微波电路和芯片封装。由于现代通信电路传输的信号频率很高，任何结构不连续都可能引起信号反射。键合线是这种效应的一个潜在来源，本研究考察了它们对信号传输性能的影响。本文根据带键合线的样品电路板的尺寸和材料特性，建立了三维电磁数值计算模型。研究了两个连接点之间不同数目的连接线的电压驻波比。建立了相应的电路模型，计算了不同焊线数下的等效电感。通过实验验证了电磁场模型和电路模型的正确性。利用这些模型，分析了不同键合线数引起的阻抗变化对模拟和数字信号完整性的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Impact of Impedance Change Caused by Bonding Wire Connection on Signal Transmission

Bonding wires are widely used in microwave circuits and chip packaging. Due to the high frequency of signals transmitted by modern communication circuits, any structural discontinuity may cause signal reflection. Bonding wires are one potential source of such effects and their impact on signal transmission performance is examined in this study. In the present work, based on the size and material characteristics of a sample circuit board with bonding wires, a 3D electromagnetic numerical calculation model was developed. The voltage standing wave ratio for various numbers of bonding wires between two connection points was studied. In addition, a corresponding circuit model was developed and the equivalent inductance for different numbers of bonding wires was calculated. Both the electromagnetic field model and the circuit model results were validated using experimental tests. Using these models, the impact of impedance changes resulting from different numbers of bonding wires on the integrity of both analog and digital signals was analyzed.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course (HLM)

自引率

0.00%

发文量