{"title":"实现5G -基板材料视角:AEM, ET/ID","authors":"I. Radu, E. Desbonnets, M. Sellier, C. Didier","doi":"10.1109/ASMC.2018.8373174","DOIUrl":null,"url":null,"abstract":"This paper reports on recent advances in material innovation and substrate technologies enabling 5G. In particular, key requirements of 5G standards such as substrate linearity, power efficiency and RF/Analog performance are discussed. The characteristics of the initial substrate define the performance and architecture of the 5G devices and circuits. The results presented in this work summarize close cooperation between RF design, device technologies and advanced substrate manufacturing.","PeriodicalId":349004,"journal":{"name":"2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Enabling 5G — A substrate material perspective: AEM, ET/ID\",\"authors\":\"I. Radu, E. Desbonnets, M. Sellier, C. Didier\",\"doi\":\"10.1109/ASMC.2018.8373174\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports on recent advances in material innovation and substrate technologies enabling 5G. In particular, key requirements of 5G standards such as substrate linearity, power efficiency and RF/Analog performance are discussed. The characteristics of the initial substrate define the performance and architecture of the 5G devices and circuits. The results presented in this work summarize close cooperation between RF design, device technologies and advanced substrate manufacturing.\",\"PeriodicalId\":349004,\"journal\":{\"name\":\"2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2018.8373174\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2018.8373174","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Enabling 5G — A substrate material perspective: AEM, ET/ID
This paper reports on recent advances in material innovation and substrate technologies enabling 5G. In particular, key requirements of 5G standards such as substrate linearity, power efficiency and RF/Analog performance are discussed. The characteristics of the initial substrate define the performance and architecture of the 5G devices and circuits. The results presented in this work summarize close cooperation between RF design, device technologies and advanced substrate manufacturing.
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