利用场氧化操作提高了CMOS光源的穿孔效率

P. J. Venter, M. du Plessis, Ilse J. Nell, M. Goosen, A. Bogalecki
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引用次数: 8

摘要

雪崩电致发光为标准CMOS器件用作光源提供了机会。虽然效率低下,但雪崩击穿本质上是一个快速的过程,与基于正向偏置结的发射相比,在速度方面有潜在的优势。此外,雪崩电致发光在可见光范围内的宽光谱特性也允许一些有趣的应用。抑制这些硅光源在主流应用中使用的主要障碍是低效的辐射复合。已知有许多技术可以提高量子效率,其中之一是在穿孔模式下操作设备。这项工作的重点是通过穿孔装置获得的改进结果,操作辐射作用以上的氧化物,以及有关辐射模式和LOCOS结构对发射形状的影响的有趣结果。这一信息可能有利于光源的光学耦合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Improved efficiency of CMOS light emitters in punch through with field oxide manipulation
Avalanche electroluminescence offers the opportunity for standard CMOS devices to be used as light emitters. Although inefficient, avalanche breakdown is inherently a fast process and potentially offers benefits in terms of speed when compared to emission based on forward biased junctions. Furthermore, the wide spectral characteristics of avalanche electroluminescence in the visible range also allows for some interesting applications. The main obstacle suppressing the use of these silicon light emitters in mainstream applications is inefficient radiative recombination. A number of techniques are known to improve quantum efficiency, one of which is operating the devices in punch through mode. This work focuses on improved results obtained from punch through devices, manipulation of the oxide above the radiative action and interesting results pertaining to the radiation pattern and the effects of LOCOS structures on the emission shape. This information could potentially benefit optical coupling to the light sources.
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