平行半模衬底集成波导之间的相互耦合

Q. Lai, Christophe Fumeaux, Wei Hong
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引用次数: 5

摘要

本文对平行半模衬底集成波导(HMSIWs)在三种不同结构下的相互耦合进行了实验研究。这三种不同的排列方式对应的情况是:首先,两个hmsiw的开放面彼此面对;其次,它们在封闭的一侧共用线性排列的金属通孔;第三,一个HMSIW的开放面与另一个HMSIW的封闭面相对。作为参考,还测量了平行微带线对之间的相互耦合,并与相应的hmsiw进行了比较。研究表明,第三种配置可以实现最佳隔离。所得结果和比较对HMSIWs在微波集成电路(mic)和阵列天线馈电设计中的应用具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Mutual coupling between parallel half-mode substrate integrated waveguides
This paper presents an experimental study on the mutual coupling between pairs of parallel half-mode substrate integrated waveguides (HMSIWs) in three different configurations. The three different arrangements correspond to the cases where, firstly the open sides of the two HMSIWs face each other; secondly they share the linear array of metallic vias at their closed side; and thirdly the open side of one HMSIW faces the closed side of the second one. As a reference, the mutual coupling between pairs of parallel microstrip lines is also measured and compared to corresponding HMSIWs. The investigation shows that the best isolation can be achieved for the third configuration. The presented results and comparisons are of importance to the application of HMSIWs in the design of microwave integrated circuits (MICs) and array antenna feeds.
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