一种防爆用增粘锌铬引线骨架涂层的分析表征及可靠性试验

C. Lee, W. Hosler, H. Cerva, R. von Criegern, A. Parthasarathi
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引用次数: 3

摘要

一种新型的Zn-Cr (A2)引线框架涂层已经被开发出来,并被证明是消除爆米花开裂的有效解决方案。采用透射电子显微镜(TEM)和飞行时间二次离子质谱(TOF-SIMS)分析了a2涂层结构和成型化合物(MC)/Cu引线框架(LF)界面。发现a2涂层是一个薄的、部分结晶的层,包括一个连续的界面层和一个晶须网络。TOF-SIMS和TEM结果确定了锌硅酸盐化合物,氧化锌和氧化铬(s)可能存在于涂层中。通过铅拉试验,研究了温度循环、高压锅测试、水分预处理和过热对A2粘附和降解机理的影响。粘附数据表明,a2增强的MC/Cu - LF粘附具有良好的耐热性和抗湿性。粘结剂的润湿和晶须提供的机械联锁被认为是增强粘结性的关键因素。在300/spl度/C下,暴露100 min后,通过Cu向外扩散形成Cu氧化物,观察到a2增强的MC/Cu LF粘附降解。在深度剖面模式下进行的俄歇电子能谱(AES)分析证实了这一点。将铅拉试样进行机械切割,以便进入MC/Cu LF界面,进行卢瑟福后向散射光谱(RBS)分析,以确定各种样品的失效位点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An analytical characterization and reliability testing of an adhesion enhancing Zn-Cr leadframe coating for popcorn prevention
A novel Zn-Cr (A2) leadframe coating has been developed and demonstrated to be an effective solution in eliminating popcorn cracking. In this investigation, the A2-coating structure and molding compound (MC)/Cu leadframe (LF) interface was analyzed by Transmission Electron Microscopy (TEM) and Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS). The A2-coating was found to be a thin, partly crystalline layer comprising a continuous interfacial layer and a network of whiskers. The TOF-SIMS and TEM results have identified Zn silicate compound, ZnO and Cr oxide(s) as possible phases present in the coating. The effect of temperature cycling, pressure cooker testing, moisture pre-conditioning, and overheating on the A2 adhesion and degradation mechanism was investigated using a lead pull test. The adhesion data showed that the A2-enhanced MC/Cu LF adhesion is resistant to thermomechanical stress and moisture degradation. The wetting of the molding compound and mechanical interlocking offered by the whiskers are believed to be key factors of adhesion enhancement. Degradation of the A2-enhanced MC/Cu LF adhesion was observed at 300/spl deg/C after 100 mins exposure through Cu oxide formation by Cu outward diffusion. This was verified by Auger Electron Spectroscopy (AES) analysis operated in the depth profiling mode. Lead pull test specimens were mechanical cleaved to have access to the MC/Cu LF interface for Rutherford Backscattering Spectroscopy (RBS) analysis to identify the locus of failure for various samples.
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