{"title":"具有多个网格约束的布局压缩算法","authors":"Jin-fuw Lee","doi":"10.1109/ICCD.1991.139837","DOIUrl":null,"url":null,"abstract":"As the chip density grows, wiring circuits on a VLSI chip becomes hard. It is then important to leave feed-through channels in the layouts of cells and macros. One strategy to achieve this goal is to keep wires on their respective wiring grids. This requirement presents a new constraint to the compaction problem of cells and macros. A new efficient algorithm is proposed to solve such a compaction problem on multiple grids. The worst-case time complexity of the algorithm is O((M+1) ( mod V mod + mod E mod )). The algorithm has been implemented in a compactor and applied to the layout designs for both microprocessor chips and ASIC chips.<<ETX>>","PeriodicalId":239827,"journal":{"name":"[1991 Proceedings] IEEE International Conference on Computer Design: VLSI in Computers and Processors","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A layout compaction algorithm with multiple grid constraints\",\"authors\":\"Jin-fuw Lee\",\"doi\":\"10.1109/ICCD.1991.139837\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the chip density grows, wiring circuits on a VLSI chip becomes hard. It is then important to leave feed-through channels in the layouts of cells and macros. One strategy to achieve this goal is to keep wires on their respective wiring grids. This requirement presents a new constraint to the compaction problem of cells and macros. A new efficient algorithm is proposed to solve such a compaction problem on multiple grids. The worst-case time complexity of the algorithm is O((M+1) ( mod V mod + mod E mod )). The algorithm has been implemented in a compactor and applied to the layout designs for both microprocessor chips and ASIC chips.<<ETX>>\",\"PeriodicalId\":239827,\"journal\":{\"name\":\"[1991 Proceedings] IEEE International Conference on Computer Design: VLSI in Computers and Processors\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-10-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[1991 Proceedings] IEEE International Conference on Computer Design: VLSI in Computers and Processors\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCD.1991.139837\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1991 Proceedings] IEEE International Conference on Computer Design: VLSI in Computers and Processors","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.1991.139837","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
摘要
随着芯片密度的增加,VLSI芯片上的布线变得越来越困难。因此,在单元格和宏的布局中留下直通通道是很重要的。实现这一目标的一个策略是将导线保持在各自的布线网格上。这一要求对单元格和宏的压缩问题提出了新的约束。提出了一种新的高效算法来解决多网格的压缩问题。算法的最坏情况时间复杂度为O((M+1) (mod V mod + mod E mod))。该算法已在一个压缩器中实现,并应用于微处理器芯片和专用集成电路芯片的版图设计。
A layout compaction algorithm with multiple grid constraints
As the chip density grows, wiring circuits on a VLSI chip becomes hard. It is then important to leave feed-through channels in the layouts of cells and macros. One strategy to achieve this goal is to keep wires on their respective wiring grids. This requirement presents a new constraint to the compaction problem of cells and macros. A new efficient algorithm is proposed to solve such a compaction problem on multiple grids. The worst-case time complexity of the algorithm is O((M+1) ( mod V mod + mod E mod )). The algorithm has been implemented in a compactor and applied to the layout designs for both microprocessor chips and ASIC chips.<>