{"title":"纳米设计的SoC解决方案-第15期","authors":"Ricki Williams","doi":"10.1109/cicc.2004.1358806","DOIUrl":null,"url":null,"abstract":"Present day semiconductor process advances are enabling the proliferation and successful realization of complete systems-on-a-chip. Integrating processors, memory, specialized embedded logic, along side analog and even RF circuits on a single die is becoming extremely challenging. Managing these complexities while optimizing the tradeoffs between hardware and software, cost, as well as time to market, calls for new strategies, disciplines, and innovative design methodologies.","PeriodicalId":407909,"journal":{"name":"Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"SoC solutions for nanometer desian - Session 15\",\"authors\":\"Ricki Williams\",\"doi\":\"10.1109/cicc.2004.1358806\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Present day semiconductor process advances are enabling the proliferation and successful realization of complete systems-on-a-chip. Integrating processors, memory, specialized embedded logic, along side analog and even RF circuits on a single die is becoming extremely challenging. Managing these complexities while optimizing the tradeoffs between hardware and software, cost, as well as time to market, calls for new strategies, disciplines, and innovative design methodologies.\",\"PeriodicalId\":407909,\"journal\":{\"name\":\"Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571)\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/cicc.2004.1358806\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/cicc.2004.1358806","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Present day semiconductor process advances are enabling the proliferation and successful realization of complete systems-on-a-chip. Integrating processors, memory, specialized embedded logic, along side analog and even RF circuits on a single die is becoming extremely challenging. Managing these complexities while optimizing the tradeoffs between hardware and software, cost, as well as time to market, calls for new strategies, disciplines, and innovative design methodologies.
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