硬件/软件协同仿真的工程环境

[1992] Proceedings 29th ACM/IEEE Design Automation Conference Pub Date : 1992-07-01 DOI:10.1109/DAC.1992.227848

D. Becker, Raj K. Singh, S. Tell

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引用次数: 87

摘要

作者描述了一个支持高性能系统并行硬件和软件工程的环境。代替传统的面包板原型，他们使用分布式通信过程来允许软件和模拟硬件交互。扩展了Cadence Verilog-XL模拟器，可以使用硬件模拟进行软件调试和测试。该环境在成功的系统设计中得到了验证。

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An engineering environment for hardware/software co-simulation

The authors describe an environment supporting concurrent hardware and software engineering for high performance systems. In place of a conventional bread-boarded prototype, they used distributed communicating processes to allow software and simulated hardware to interact. The Cadence Verilog-XL simulator was extended to enable software debugging and testing using hardware simulation. The environment was proven during a successful system design.<>

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[1992] Proceedings 29th ACM/IEEE Design Automation Conference

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