塑料包装热湿破坏的有限元分析

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298765

N. Sun, D. Lin, Daoguo Yang

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引用次数: 2

摘要

本文着重介绍了用有限元模拟方法分析湿热诱发破坏机理的方法。目的是如何通过水分浓度来评估蒸汽压。为了预测失效发生的位置，引入了一个改进的Gurson模型，并将其扩展为代表蒸汽压的贡献。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Finite element analysis of hygro-thermal induced failure in plastic packages

This paper focuses on ways to analysis the hygro-thermal induced failure mechanism with finite element simulations. The objective is how to evaluate the vapor pressure through the moisture concentration. To predict the position where the failure would happen, a modified Gurson's model is induced and is expanded to represent the contribution of the vapor pressure.

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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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