基于1994年国家半导体技术路线图的计量要求概述

A. Diebold
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引用次数: 44

摘要

1994年,半导体工业协会制定并发布了第二个集成电路制造路线图:国家半导体技术路线图(NTRS)。计量要求跨越了材料和批量工艺(晶体管制造工艺)、光刻、互连、设计和电气测试以及工厂集成的界限。在NTRS中,计量被称为横切需求,具体需求可以在技术部分找到。为了补充NTRS, SEMATECH发布了计量路线图。该路线图由SEMATECH成员公司、NIST、Sandia和计量工具供应商的代表制定。计量路线图中的测量要求直接取自NTRS,即栅介电厚度与技术生成的时间轴。作者提供了计量路线图的概述,并讨论了关键趋势,如向实时过程控制的移动。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Overview of metrology requirements based on the 1994 National Technology Roadmap for semiconductors
During 1994, the Semiconductor Industry Association developed and issued the second integrated circuit manufacturing roadmap: The National Technology Roadmap for Semiconductors (NTRS). Metrology requirements cut across the boundaries of materials and bulk processes (transistor fabrication processes), lithography, interconnect, design and electrical test, and factory integration. In the NTRS, Metrology is referred to as a cross-cut requirement and specific needs can be found in the technology sections. In order to supplement the NTRS, a Metrology Roadmap was published by SEMATECH. The roadmap was developed by representatives from the SEMATECH member companies, NIST, Sandia, and metrology tool suppliers. The measurement requirements in the Metrology Roadmap are taken directly from the NTRS, i.e., the timeline for gate dielectric thickness vs. technology generation. The author provides an overview of the Metrology Roadmap and discusses key trends such as the move toward real time process control.
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