双极晶体管中压电结效应的方向依赖性

J. Creemer, P. French
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引用次数: 12

摘要

封装和加工过程中产生的机械应力会显著改变双极晶体管的饱和电流。这种效应通常是通过应力引起的固有载流子浓度的变化来模拟的,这取决于应力的方向。这种变化现在已经计算了不同的单轴应力高达200mpa的硅。它已被发现随应力呈抛物线变化,特别是在方向上。测量结果显示集电极电流也有类似的变化。这些测量是在pnp和npn晶体管上进行的,用于不同的电流和应力方向。他们还表明,在考虑的应力范围内,少数族裔流动性的变化是不可忽视的。它在很大程度上取决于少数类型及其电流通过基底的方向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Orientation Dependence of the Piezojunction Effect in Bipolar Transistors
Mechanical stress by packaging and processing can considerably change the saturation current of bipolar transistors. This effect was usually modelled through the stress-induced change in the intrinsic carrier concentration, which depends on the orientation of the stress. This change has now been calculated for silicon for different uniaxial stresses up to 200 MPa. It has been found to vary parabolically with stress, especially for the <100> directions. Measurements show a similar variation of the collector current. These measurements were done on both pnp and npn transistors, for different orientations of current and stress. They also show that the change in the minority mobility cannot be neglected for the stress range considered. It strongly depends on the minority type and the direction of its current through the base.
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