R. Mair, G. A. Antonelli, M. Mehendale, P. Mukundhan, Beth May, Karen Terry, N. Brandt, Xiaoyue Phillip Huang, Tong Zhao
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Non-Contact, In-Line Thermal Characterization Capability with Time Domain Thermoreflectance
Thermal management is a critical aspect of integrated device design and manufacture. Time Domain Thermoreflectance (TDTR) is a powerful tool for the characterization of thermal transport in thin films and multi-layer stacks. In this paper, we present successful extension of in-line non-contact, non-destructive picosecond ultrasonic metrology for simultaneous measurements of layer thickness and thermal properties.
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