{"title":"过孔与PCB电源总线之间的相互作用","authors":"G. Heinrich, S. Dickmann","doi":"10.1109/EMCZUR.2009.4783439","DOIUrl":null,"url":null,"abstract":"In this paper, a method for the investigation of the interactions between a via and a PCB power-bus is described. Starting with an initial via model and two types of de-embedding algorithm, which extract the scattering parameters of the via, the elements of the via model are derived. After that the influence of the via on the power-bus impedance and the interactions between the via and the power-bus are described.","PeriodicalId":192851,"journal":{"name":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Interactions between Vias and the PCB Power-Bus\",\"authors\":\"G. Heinrich, S. Dickmann\",\"doi\":\"10.1109/EMCZUR.2009.4783439\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a method for the investigation of the interactions between a via and a PCB power-bus is described. Starting with an initial via model and two types of de-embedding algorithm, which extract the scattering parameters of the via, the elements of the via model are derived. After that the influence of the via on the power-bus impedance and the interactions between the via and the power-bus are described.\",\"PeriodicalId\":192851,\"journal\":{\"name\":\"2009 20th International Zurich Symposium on Electromagnetic Compatibility\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-02-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 20th International Zurich Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCZUR.2009.4783439\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCZUR.2009.4783439","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In this paper, a method for the investigation of the interactions between a via and a PCB power-bus is described. Starting with an initial via model and two types of de-embedding algorithm, which extract the scattering parameters of the via, the elements of the via model are derived. After that the influence of the via on the power-bus impedance and the interactions between the via and the power-bus are described.
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