铜互连技术——BEOL制造的新范式

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) Pub Date : 1998-09-23 DOI:10.1109/ASMC.1998.731586

K. Rose, R. Mangaser

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引用次数: 7

摘要

铜作为一种商业互连工艺的出现意味着后端线(BEOL)制造的根本变化。在1997年国家半导体技术路线图的指导下，我们研究了BEOL制造的未来。重点介绍了改用铜和未来BEOL产量趋势。

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Copper interconnect technology-new paradigms for BEOL manufacturing

The advent of copper as a commercial interconnect process means radical changes in back-end-of-line (BEOL) manufacturing. We examine the future of BEOL manufacturing guided by the 1997 National Technology Roadmap for Semiconductors. Changing to copper and future BEOL yield trends are emphasized.

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IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168)

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