{"title":"Microstructure and mechanical properties of Au60AgCu joints brazed with Sn63Pb solder","authors":"Xiuli Wang, Xinhua Wang","doi":"10.1109/icept.2017.8046440","DOIUrl":null,"url":null,"abstract":"The joints of Au60AgCu alloy to silver and copper plated wire were obtained by using Sn63Pb solder, and the microstructure and mechanical properties of the brazing joints were investigated. The shear strength and the reliability of joints after the high and low temperature test were evaluated in this study.","PeriodicalId":386197,"journal":{"name":"2017 18th International Conference on Electronic Packaging Technology (ICEPT)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 18th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/icept.2017.8046440","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Microstructure and mechanical properties of Au60AgCu joints brazed with Sn63Pb solder
The joints of Au60AgCu alloy to silver and copper plated wire were obtained by using Sn63Pb solder, and the microstructure and mechanical properties of the brazing joints were investigated. The shear strength and the reliability of joints after the high and low temperature test were evaluated in this study.