塑料仿真在功率模块开发中的应用

T. Kashko, M. Essert
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引用次数: 0

摘要

塑料被用作电源模块外壳的材料。这部分最明显的功能是电绝缘,以及保护芯片免受环境污染(如灰尘)。外壳还设计用于承载和分配机械负载,用于定位引脚和母线,并用于包含硅胶直至其硬化。外壳还为电路板提供连接点。选择塑料的原因是,通过正确选择基础材料、生产工艺和添加添加剂,塑料的可塑性、刚度、强度和耐化学性等性能可以得到优化。塑料的材料性能不仅取决于温度或当前负载状态,还取决于生产方法、负载分布、使用年限和塑料所承受的环境条件(如湿度)。外壳机械性能的差异经常导致模块的金属部件承受额外的应力。改进塑料部件的设计可以减少这些其他部件的负荷。塑料外壳的模拟可以帮助预测模块在相关测试和应用条件下的行为,并且可以简化和加速模块的开发,以实现更好的力学行为。在本文中,讨论了塑料材料模拟策略的潜在弱点。无论采用哪种材料模型对塑性进行模拟(弹性、粘弹性或粘塑性),通常都将其描述为均质和各向同性材料。在科学论文或材料数据表等不同来源发表的塑料的材料特性已经从测试样本中进行了评估。实际上,更复杂的形式表现出不均匀的各向异性行为,即使是纯塑料和非增强塑料。这种情况被短纤维增强塑料的使用放大了。在这里,外壳的完整机械性能受到注塑成型过程中产生的纤维方向以及外壳几何形状和金属插入件位置的影响。它还取决于焊缝的位置,这被认为是任何塑料部件的弱点。如果考虑到塑性零件的各向异性和非均质性,则可以更好地预测所选零件的临界区域。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Application of simulation of plastics in the development of power modules
Plastics are used as the material for the housing of power modules. The most obvious function of this part is the electrical insulation as well as protecting the chips from the environmental pollution (e.g. dust). The housing is also designed to carry and distribute mechanical loads, for the positioning of the pins and bus bars and for containing the silicon gel until it is hardened. The housing also provides a connection point for the circuit board. Plastics are chosen due to the fact, that their properties such as moldability, stiffness, strength, and chemical resistance can be optimized by the correct choice of the basis material, the production process and by the inclusion of additives. The material behavior of the plastics depends not only on the temperature or current load state, but also on production method, load profile, age and environmental conditions such as humidity that the plastic is subjected to. The difference in mechanical behavior of the housing frequently results in an additional stress on the metallic components of the module. Improving the design of the plastic parts can reduce this load on these other components. Simulation of the plastic housing can help to predict module behavior in the relevant tests, under application conditions, and can simplify and accelerate the module development to achieve a better mechanical behavior. In the presented paper, potential weak points of the simulation strategies for the plastic material have been addressed. No matter which material model is used for simulation of the plastic (elastic, viscoelastic or viscoplastic), it is usually described as a homogeneous and an isotropic material. The material properties of the plastics, published in different sources like scientific papers or material data sheets, have been evaluated from testing specimens. In practice the more complex forms show inhomogeneous anisotropic behavior, even with pure and unreinforced plastics. This situation is amplified by the use of the short fibre reinforced plastics. Here, the complete mechanical behavior of the housing is influenced by the fiber orientation resulting from the injection molding process as well as from the housing geometry and positions of the metallic inserts. It also depends on position of weld lines, which are considered as the weak points of any plastic component. If the anisotropy and inhomogenity of the plastic part is taken into account, a better prediction of the critical areas of the chosen part can be achieved.
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