{"title":"多芯片模块的最佳引脚再分配","authors":"Jun-Dong Cho","doi":"10.1109/MCMC.1996.510779","DOIUrl":null,"url":null,"abstract":"We introduce an optimum algorithm for the pin redistribution problem which arises in Multi-Chip Modules. The problem is to redistribute the pins in chip layer to the pin redistribution layers, using a minimum number of layers. The proposed algorithm is based on a two-stage approach, global routing followed by layer assignment. Each subproblem has an optimality structure. Based on min-cost flow formulation along with graph manipulations, we propose a performance-driven algorithm to minimize the number of layers and also simultaneously optimize the wirelength and the number of bends.","PeriodicalId":126969,"journal":{"name":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"An optimum pin redistribution for MultiChip modules\",\"authors\":\"Jun-Dong Cho\",\"doi\":\"10.1109/MCMC.1996.510779\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We introduce an optimum algorithm for the pin redistribution problem which arises in Multi-Chip Modules. The problem is to redistribute the pins in chip layer to the pin redistribution layers, using a minimum number of layers. The proposed algorithm is based on a two-stage approach, global routing followed by layer assignment. Each subproblem has an optimality structure. Based on min-cost flow formulation along with graph manipulations, we propose a performance-driven algorithm to minimize the number of layers and also simultaneously optimize the wirelength and the number of bends.\",\"PeriodicalId\":126969,\"journal\":{\"name\":\"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)\",\"volume\":\"4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-02-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1996.510779\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1996.510779","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An optimum pin redistribution for MultiChip modules
We introduce an optimum algorithm for the pin redistribution problem which arises in Multi-Chip Modules. The problem is to redistribute the pins in chip layer to the pin redistribution layers, using a minimum number of layers. The proposed algorithm is based on a two-stage approach, global routing followed by layer assignment. Each subproblem has an optimality structure. Based on min-cost flow formulation along with graph manipulations, we propose a performance-driven algorithm to minimize the number of layers and also simultaneously optimize the wirelength and the number of bends.