多芯片模块的最佳引脚再分配

Jun-Dong Cho
{"title":"多芯片模块的最佳引脚再分配","authors":"Jun-Dong Cho","doi":"10.1109/MCMC.1996.510779","DOIUrl":null,"url":null,"abstract":"We introduce an optimum algorithm for the pin redistribution problem which arises in Multi-Chip Modules. The problem is to redistribute the pins in chip layer to the pin redistribution layers, using a minimum number of layers. The proposed algorithm is based on a two-stage approach, global routing followed by layer assignment. Each subproblem has an optimality structure. Based on min-cost flow formulation along with graph manipulations, we propose a performance-driven algorithm to minimize the number of layers and also simultaneously optimize the wirelength and the number of bends.","PeriodicalId":126969,"journal":{"name":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1996-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"An optimum pin redistribution for MultiChip modules\",\"authors\":\"Jun-Dong Cho\",\"doi\":\"10.1109/MCMC.1996.510779\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We introduce an optimum algorithm for the pin redistribution problem which arises in Multi-Chip Modules. The problem is to redistribute the pins in chip layer to the pin redistribution layers, using a minimum number of layers. The proposed algorithm is based on a two-stage approach, global routing followed by layer assignment. Each subproblem has an optimality structure. Based on min-cost flow formulation along with graph manipulations, we propose a performance-driven algorithm to minimize the number of layers and also simultaneously optimize the wirelength and the number of bends.\",\"PeriodicalId\":126969,\"journal\":{\"name\":\"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-02-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1996.510779\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1996.510779","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

摘要

针对多芯片模块中出现的引脚重分配问题,提出了一种优化算法。问题是使用最少的层数将芯片层中的引脚重新分配到引脚重新分配层。该算法基于两阶段的方法,即全局路由和层分配。每个子问题都有一个最优性结构。基于最小成本流公式和图形处理,我们提出了一种性能驱动的算法,以最小化层数,同时优化线段长度和弯道数量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An optimum pin redistribution for MultiChip modules
We introduce an optimum algorithm for the pin redistribution problem which arises in Multi-Chip Modules. The problem is to redistribute the pins in chip layer to the pin redistribution layers, using a minimum number of layers. The proposed algorithm is based on a two-stage approach, global routing followed by layer assignment. Each subproblem has an optimality structure. Based on min-cost flow formulation along with graph manipulations, we propose a performance-driven algorithm to minimize the number of layers and also simultaneously optimize the wirelength and the number of bends.
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