扩展高速Si/Si/sub - 1-x/Ge/sub -x/ HBT的共发射极击穿电压

M. Shaheed, C. Maziar
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引用次数: 5

摘要

模拟了不同的集电极结构,以确定导致高速硅基异质结双极晶体管击穿电压增加的设计方案。作者提出了一种增加击穿电压的方法,通过适当地调整集电极中的掺杂剖面。发现两部分集电极掺杂剖面降低雪崩倍增比超过一个数量级。仿真结果表明,这种改进可以在不严重降低基推效应的情况下实现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Extension of common-emitter breakdown voltage for high speed Si/Si/sub 1-x/Ge/sub x/ HBT's
Various collector structures were simulated to identify design options which lead to an increase in the breakdown voltage of high speed SiGe-base heterojunction bipolar transistors (HBTs). The authors propose an approach for increasing the breakdown voltage by appropriately tailoring the doping profile in the collector. A two-part collector doping profile was found to reduce the avalanche multiplication ratio by more than an order of magnitude. Simulation results indicate that this improvement can be achieved without severe degradation of the base pushout effect.<>
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