{"title":"陶瓷电容器漏损失效分析","authors":"J. Cui, Junming Wu","doi":"10.1109/ICEPT.2015.7236671","DOIUrl":null,"url":null,"abstract":"Failure analysis is a comprehensive process which needs to apply kinds of physical and chemistry methods to find out the mechanism. You must learn as more background information as you can, only then could you choose the applicable methods to study the failure sample avoiding disturbance aroused by analysis methods. In this paper, a print circuit board assembly of TV sets which were exported to South America will be analyzed.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A failure analysis on leakage of ceramic capacitor\",\"authors\":\"J. Cui, Junming Wu\",\"doi\":\"10.1109/ICEPT.2015.7236671\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Failure analysis is a comprehensive process which needs to apply kinds of physical and chemistry methods to find out the mechanism. You must learn as more background information as you can, only then could you choose the applicable methods to study the failure sample avoiding disturbance aroused by analysis methods. In this paper, a print circuit board assembly of TV sets which were exported to South America will be analyzed.\",\"PeriodicalId\":415934,\"journal\":{\"name\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-09-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2015.7236671\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2015.7236671","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A failure analysis on leakage of ceramic capacitor
Failure analysis is a comprehensive process which needs to apply kinds of physical and chemistry methods to find out the mechanism. You must learn as more background information as you can, only then could you choose the applicable methods to study the failure sample avoiding disturbance aroused by analysis methods. In this paper, a print circuit board assembly of TV sets which were exported to South America will be analyzed.
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