可编程逻辑器件封装的功率传输建模与设计方法

Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI:10.1109/EPEP.2004.1407561

A. Pannikkat, J. Long, Jin Zhao

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引用次数: 5

摘要

本文提出了一种可编程逻辑器件封装的功率传输建模和设计方法。利用市售电源完整性软件对直流红外降和高频电源地输入阻抗进行了分析，并进行了测量校准。然后进行了设计修改，以改进下一代产品的电源传输系统。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Power delivery modeling and design methodology for a programmable logic device package

A power delivery modeling and design methodology for a programmable logic device package is presented in this paper. Both the DC IR drop and high frequency power ground input impedance have been analyzed by commercial available power integrity software and calibrated with measurements. Design modifications have then been carried out for power delivery system improvement of the package for next generation products.

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Electrical Performance of Electronic Packaging - 2004

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