沟槽功率MOSFET低侧开关,优化集成肖特基二极管

D. Calafut
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引用次数: 33

摘要

这项工作研究了用于低侧开关或同步整流器应用的集成mosfet -肖特基二极管解决方案的器件和电路性能。集成二极管结构为沟槽MOS势垒肖特基(TMBS)器件,TMBS结构面积占总有源面积的比例为本研究的自变量,取值范围为0 ~ 50%。仿真和实验结果表明,TMBS面积的最优贡献能使集成器件的性能达到最大。最初,结果提供了TMBS贡献,二极管恢复特性和DC-DC转换器效率之间的强相关性。然而,对器件级电流分布波形以及转换器中的功率损耗机制进行更仔细的检查,揭示了TMBS结构和MOSFET之间更复杂的相互作用。只有在这种分析的背景下,才能提取出有用的设备设计洞察力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Trench power MOSFET lowside switch with optimized integrated Schottky diode
This work investigates the device and circuit performance of an integrated MOSFET-Schottky diode solution for lowside switching, or synchronous rectifier, applications. The integrated diode structure is a trench MOS barrier Schottky (TMBS) device, and the area of the TMBS structure, as a ratio of the total active area, was the independent variable in this study, ranging from zero to 50%. The results of both simulation and experiments show that there is an optimum contribution of TMBS area which maximizes the performance of the integrated device. Initially, the results provided a strong correlation between TMBS contribution, diode recovery characteristics, and DC-DC converter efficiency. However, a closer examination of the underlying, device level current distribution waveforms, as well as the power loss mechanisms in the converter, reveal a more complex interaction of the TMBS structure and the MOSFET. It is only in the context of this analysis, that useful device design insight can be extracted.
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