扩散氢对硅器件辐射硬度的影响

E. Polushkin, S. V. Nefediev, A. Kovalchuk, O. Soltanovich, S. Shapoval
{"title":"扩散氢对硅器件辐射硬度的影响","authors":"E. Polushkin, S. V. Nefediev, A. Kovalchuk, O. Soltanovich, S. Shapoval","doi":"10.1117/12.2624184","DOIUrl":null,"url":null,"abstract":"The paper discusses methods for increasing the resistance of silicon semiconductor devices to ionizing radiation. A key feature of the presented methods is that there is no need to modify the topology, i.e. the described technological methods make it possible to increase the stability of integrated circuits by adding some technological operations to the standard process flow (not radiation hardy).","PeriodicalId":388511,"journal":{"name":"International Conference on Micro- and Nano-Electronics","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Influence of diffusion hydrogen on the radiation hardness of silicon devices\",\"authors\":\"E. Polushkin, S. V. Nefediev, A. Kovalchuk, O. Soltanovich, S. Shapoval\",\"doi\":\"10.1117/12.2624184\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper discusses methods for increasing the resistance of silicon semiconductor devices to ionizing radiation. A key feature of the presented methods is that there is no need to modify the topology, i.e. the described technological methods make it possible to increase the stability of integrated circuits by adding some technological operations to the standard process flow (not radiation hardy).\",\"PeriodicalId\":388511,\"journal\":{\"name\":\"International Conference on Micro- and Nano-Electronics\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-01-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Conference on Micro- and Nano-Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2624184\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Conference on Micro- and Nano-Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2624184","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本文讨论了提高硅半导体器件抗电离辐射能力的方法。所提出的方法的一个关键特征是不需要修改拓扑结构,即所描述的技术方法可以通过在标准工艺流程(不耐辐射)中添加一些技术操作来增加集成电路的稳定性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of diffusion hydrogen on the radiation hardness of silicon devices
The paper discusses methods for increasing the resistance of silicon semiconductor devices to ionizing radiation. A key feature of the presented methods is that there is no need to modify the topology, i.e. the described technological methods make it possible to increase the stability of integrated circuits by adding some technological operations to the standard process flow (not radiation hardy).
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