在实际IC/封装设计中先进的模型降阶技术

Z. Peng, Yang Shao, Jin-Fa Lee
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引用次数: 3

摘要

一个现实生活中的包装是一个多端口系统与宽带频率感兴趣。这种宽频带多输入/多输出响应的有效求解增加了电磁仿真的计算复杂度。本文提出了一种能够快速准确地计算多端口多频率响应的提前模型降阶(MOR)算法。该MOR技术基于多点Galerkin渐近波形评估(MGAWE)来实现快速扫频过程的自动化,并基于循环Krylov子空间方法(GCRO-DR)来进一步提高效率,并减少在不同频率下多端口激励下求解DDM矩阵方程所需的矩阵向量(MV)乘法。数值结果验证了分析结果,并在实际的三维全封装信号完整性分析中验证了该方法的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Advanced model order reduction technique in real-life IC/package design
An real-life packaging is a multi-port system with a wide band frequency of interest. The efficient solution of such multi-input/multi-output responses over a wide frequency band adds extraordinary computational complexity to Electromagnetic simulation. In this paper, we proposed an advance model order reduction (MOR) algorithm, that is capable of producing fast and accurate computation of multi-port multi-frequency responses. This MOR technique is based on a multipoint Galerkin asymptotic waveform evaluation (MGAWE) to automate the fast frequency sweep process, and a recycling Krylov subspaces method, GCRO-DR, to gain further efficiency and to reduce the needed matrix-vector (MV) multiplications required in solving DDM matrix equation at different frequencies with multi-port excitation. Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.
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