使用曲面积分公式的三维互连的全波电磁特性

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI:10.1109/EPEPS.2017.8329738

U. Patel, Shashwat Sharma, Shunchuan Yang, S. Hum, P. Triverio

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引用次数: 19

摘要

本文提出了一种精确的曲面积分方程，用于互连的建模。它使用最近开发的3D差分表面导纳算子准确捕获导体内部的趋肤效应。数值结果表明，在计算时间和内存消耗方面，所提出的公式明显比现有的体积方法更有效。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Full-wave electromagnetic characterization of 3D interconnects using a surface integral formulation

This paper presents an accurate surface integral equation formulation for modeling interconnects. It accurately captures the skin effect inside conductors using a recently-developed 3D differential surface admittance operator. Numerical results demonstrate that the proposed formulation is significantly more efficient than existing volumetric techniques in terms of computational time and memory consumption.

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来源期刊

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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