{"title":"蓝宝石激光剥离垂直结构UV LED器件的制造与封装","authors":"Hao Zhu, Jianfei Xi, J. G. Liu","doi":"10.1109/SSLCHINA.2015.7360681","DOIUrl":null,"url":null,"abstract":"As UV LED technology advances, more and more new applications emerge. This paper describes design, fabrication and packaging of a vertical-structured UV LED device. Laser lift-off (LLO) method is used in the fabrication of a 45mil × 45mil LED, which allows us to remove the Sapphire substrate and absorptive GaN layers in the epitaxy. By doing this, the UV light absorption within the epitaxy is minimized and the efficacy of the device is significantly improved. In this paper, we will describe the fabrication process for achieving higher efficiency UVA chip, and report the device performance. Packaging technology and failure mechanisms under UV condition will also be discussed.","PeriodicalId":331882,"journal":{"name":"2015 12th China International Forum on Solid State Lighting (SSLCHINA)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Fabrication and packaging of a vertical-structured UV LED device by laser lift-off of Sapphire\",\"authors\":\"Hao Zhu, Jianfei Xi, J. G. Liu\",\"doi\":\"10.1109/SSLCHINA.2015.7360681\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As UV LED technology advances, more and more new applications emerge. This paper describes design, fabrication and packaging of a vertical-structured UV LED device. Laser lift-off (LLO) method is used in the fabrication of a 45mil × 45mil LED, which allows us to remove the Sapphire substrate and absorptive GaN layers in the epitaxy. By doing this, the UV light absorption within the epitaxy is minimized and the efficacy of the device is significantly improved. In this paper, we will describe the fabrication process for achieving higher efficiency UVA chip, and report the device performance. Packaging technology and failure mechanisms under UV condition will also be discussed.\",\"PeriodicalId\":331882,\"journal\":{\"name\":\"2015 12th China International Forum on Solid State Lighting (SSLCHINA)\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 12th China International Forum on Solid State Lighting (SSLCHINA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SSLCHINA.2015.7360681\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 12th China International Forum on Solid State Lighting (SSLCHINA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SSLCHINA.2015.7360681","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fabrication and packaging of a vertical-structured UV LED device by laser lift-off of Sapphire
As UV LED technology advances, more and more new applications emerge. This paper describes design, fabrication and packaging of a vertical-structured UV LED device. Laser lift-off (LLO) method is used in the fabrication of a 45mil × 45mil LED, which allows us to remove the Sapphire substrate and absorptive GaN layers in the epitaxy. By doing this, the UV light absorption within the epitaxy is minimized and the efficacy of the device is significantly improved. In this paper, we will describe the fabrication process for achieving higher efficiency UVA chip, and report the device performance. Packaging technology and failure mechanisms under UV condition will also be discussed.
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