电子束直写光刻:光学光刻的通用技术

F. Laulagnet, Jacques-Alexandre Dallery, L. Pain, M. May, Béatrice Hémard, Franck Garlet, I. Servin, C. Sabbione
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引用次数: 0

摘要

电子束直写(EBDW或电子束)光刻是世界范围内用于实验室,大学和试验线设施的研究和开发的参考技术。由于其低写入速度,E-Beam直接写入从未被认为是一种可接受的工业解决方案,光学掩模制造除外。尽管如此,其天然的高分辨率能力使得先进或创新设备的低成本模式在大批量生产之前得以实现。由于其具有几乎所有类型的化学放大抗蚀剂的通用性,EBDW是光学光刻的完美补充解决方案。本文演示了EBDW光刻与先进的负色调显影(NTD)抗蚀剂的兼容性,以及建立在分辨率和混合匹配覆盖方面具有高性能的电子束/193i混合光刻工艺流程的可能性。这种高端光刻战略联盟为设备开发研发提供了灵活性和成本优势,同时也为电路加密等特定应用提供了强大的可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
E-beam direct write lithography: the versatile ally of optical lithography
Electron Beam Direct Write (EBDW or E-Beam) Lithography is a worldwide reference technology used in laboratories, universities and pilot line facilities for Research and Developments. Due to its low writing speed, E-Beam direct write has never been recognized as an acceptable industrial solution, exception made for optical mask manufacturing. Nevertheless, its natural high-resolution capability allows low-cost patterning of advanced or innovative devices ahead of their high-volume manufacturing ramp-up. Thanks to its full versatility with almost all type of chemically amplified resists, EBDW is a perfect complementary solution to optical lithography. This paper demonstrates the compatibility of EBDW lithography with advanced Negative Tone Development (NTD) resist and the possibility to set-up an hybrid E-Beam/193i lithography process flow with high performances in terms of resolution and mix & match overlay. This high-end lithography strategy alliance offers flexibility and cost advantages for device development R&D but also powerful possibilities for specific applications such circuit encryption as discussed at the end of this work-study.
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