{"title":"基于分层PEEC的SiP结构输电网阻抗分析","authors":"Y. Uematsu, H. Taniguchi, M. Toyama","doi":"10.1109/EPEPS47316.2019.193235","DOIUrl":null,"url":null,"abstract":"As a technology for simulating power-delivery network (PDN) impedance of a system-in-package (SiP) structure, a method that uses a partial-element-equivalent-circuit (PEEC) model—whose mesh size is varied according to the hierarchy of the PDN—is proposed.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Analysis of Impedance of Power-delivery Network with SiP Structure by using Hierarchical PEEC\",\"authors\":\"Y. Uematsu, H. Taniguchi, M. Toyama\",\"doi\":\"10.1109/EPEPS47316.2019.193235\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As a technology for simulating power-delivery network (PDN) impedance of a system-in-package (SiP) structure, a method that uses a partial-element-equivalent-circuit (PEEC) model—whose mesh size is varied according to the hierarchy of the PDN—is proposed.\",\"PeriodicalId\":304228,\"journal\":{\"name\":\"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"volume\":\"39 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS47316.2019.193235\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS47316.2019.193235","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Analysis of Impedance of Power-delivery Network with SiP Structure by using Hierarchical PEEC
As a technology for simulating power-delivery network (PDN) impedance of a system-in-package (SiP) structure, a method that uses a partial-element-equivalent-circuit (PEEC) model—whose mesh size is varied according to the hierarchy of the PDN—is proposed.