{"title":"平面磁性元件的两种自由空气对流和辐射热模型","authors":"Lai-Dac Kien, Y. Lembeye, B. Sarrazin","doi":"10.1109/ISIE.2011.5984068","DOIUrl":null,"url":null,"abstract":"Thermal is considered as a principal constraint in size reduction of passive components in power electronics. In fact, the maximum temperature rise of component must be kept under a limit that heat dissipation cannot destroy the device materials. Therefore thermal modelling has to be taken in design optimisation of the components. We propose, in this paper, two analytical thermal models of free convection and radiation that can be applied to planar magnetic components. The models are verified by experimental tests, advantages and weakness of each model are analyzed to find out an appropriate one using in optimization tools.","PeriodicalId":162453,"journal":{"name":"2011 IEEE International Symposium on Industrial Electronics","volume":"187 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Two free air convection and radiation thermal models for planar magnetic components\",\"authors\":\"Lai-Dac Kien, Y. Lembeye, B. Sarrazin\",\"doi\":\"10.1109/ISIE.2011.5984068\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thermal is considered as a principal constraint in size reduction of passive components in power electronics. In fact, the maximum temperature rise of component must be kept under a limit that heat dissipation cannot destroy the device materials. Therefore thermal modelling has to be taken in design optimisation of the components. We propose, in this paper, two analytical thermal models of free convection and radiation that can be applied to planar magnetic components. The models are verified by experimental tests, advantages and weakness of each model are analyzed to find out an appropriate one using in optimization tools.\",\"PeriodicalId\":162453,\"journal\":{\"name\":\"2011 IEEE International Symposium on Industrial Electronics\",\"volume\":\"187 2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-06-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE International Symposium on Industrial Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISIE.2011.5984068\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE International Symposium on Industrial Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISIE.2011.5984068","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Two free air convection and radiation thermal models for planar magnetic components
Thermal is considered as a principal constraint in size reduction of passive components in power electronics. In fact, the maximum temperature rise of component must be kept under a limit that heat dissipation cannot destroy the device materials. Therefore thermal modelling has to be taken in design optimisation of the components. We propose, in this paper, two analytical thermal models of free convection and radiation that can be applied to planar magnetic components. The models are verified by experimental tests, advantages and weakness of each model are analyzed to find out an appropriate one using in optimization tools.
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