氢和氘掺入对GaAs MESFET电性能的影响

D.C. Eng, R. Culbertson, K. Macwilliams
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引用次数: 5

摘要

在5%氢气中退火的商用GaAs MESFET的导通电压发生了变化,其跨导和漏极电流都出现了下降。在氘中退火也表现出类似的行为,尽管不那么广泛,这表明氘扩散到器件中的速度比氢慢。薄膜扩散实验表明,当铂与氢接触时,氢在栅区的掺入量最大。提供了支持性证据,证明氢的扩散发生在Au/Pt/Ti栅极金属的Pt侧壁而不是Au表面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The effects of hydrogen and deuterium incorporation on the electrical performance of a GaAs MESFET
A commercial GaAs MESFET annealed in 5% hydrogen showed shifts in its turn-on voltage and degradation in both its transconductance and drain current. Annealing in deuterium showed similar, though less extensive behavior, indicating that deuterium diffuses into the devices slower than hydrogen. A thin film diffusion experiment showed that the incorporation of hydrogen into the gate area is greatest when platinum is exposed to the hydrogen. Provides supporting evidence that diffusion of hydrogen occurs at the Pt sidewalls and not at the Au surface of the Au/Pt/Ti gate metal.
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