F. Buckley, S. Chen, J. Hilse, M. Homan, G. Machol, L. Pereira, J. Terry, G. Watanabe
{"title":"双极32b处理器芯片","authors":"F. Buckley, S. Chen, J. Hilse, M. Homan, G. Machol, L. Pereira, J. Terry, G. Watanabe","doi":"10.1109/ISSCC.1986.1156966","DOIUrl":null,"url":null,"abstract":"The architecture, circuitry, packaging and design of a 14×16mm 32b CPU chip dissipating 16W will be described. The chip, which has been built in a 2μm bipolar process with 8-level cascode ECL circuitry, executes a mainframe instruction set.","PeriodicalId":440688,"journal":{"name":"1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A bipolar 32b processor chip\",\"authors\":\"F. Buckley, S. Chen, J. Hilse, M. Homan, G. Machol, L. Pereira, J. Terry, G. Watanabe\",\"doi\":\"10.1109/ISSCC.1986.1156966\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The architecture, circuitry, packaging and design of a 14×16mm 32b CPU chip dissipating 16W will be described. The chip, which has been built in a 2μm bipolar process with 8-level cascode ECL circuitry, executes a mainframe instruction set.\",\"PeriodicalId\":440688,\"journal\":{\"name\":\"1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.1986.1156966\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.1986.1156966","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The architecture, circuitry, packaging and design of a 14×16mm 32b CPU chip dissipating 16W will be described. The chip, which has been built in a 2μm bipolar process with 8-level cascode ECL circuitry, executes a mainframe instruction set.