J. Shealy, M. Hashemi, K. Kiziloglu, S. Denbaars, U. Mishra, T.K. Liu, I. Brown, M. Lui
{"title":"基于MOCVD的高频率、高击穿AlInAs/GaInAs结调制器件(jhemt","authors":"J. Shealy, M. Hashemi, K. Kiziloglu, S. Denbaars, U. Mishra, T.K. Liu, I. Brown, M. Lui","doi":"10.1109/DRC.1993.1009632","DOIUrl":null,"url":null,"abstract":"AlInAs/GaInAs High Electron Mobility Transistors excellent high frequency and low noise performance [l]. (HEMTs) have shown However, the power performance of the AlInAdGaInAs channel HEMT has yet to be exploited [2]. The reason is a combination of the lower breakdown voltage in the InGaAs channel and the weak Schottky-barrier height on A M s . On the other hand, the high current densities, due to the large sheet charge density available in the AlInAdGaInAs system make it attractive for millimeter-wave power. Therefore, to optimize the power performance of the AlInAdGaInAs HEMT, the gate barrier height and the breakdown voltage must be improved without sacrificing currcnt density. We present a technology to increase the gatedrain breakdown of AlInAs-GalnAs HEMTs tb record values without substantial impact on other parameters such as Idss and gm. The breakdown in these structures is dependent on the multiplication of electrons injected from the gate (gate leakage) and the source (source cumnt) into the channel. In addition holes are generated by high fields at the drain and arc swept back into the gate and source electrodes. These phenomena can be suppressed by increasing the gate barrier height and alleviating the fields at the drain. In our approach we have achieved both by incorporating a P+ 2DEG junction as the gate which modulates the 2DEG gas and by utilizing a selective regrowth of the some and drain regions by MOCVD. The l p gate-length devices fabricated show a full channel current of 340 “m, transconductance of 240 mS/mm and record high gate-drain breakdown voltage of 3OV (4;~ = l p ) at lmA/mm gate leakage. This is a substantial increase in breakdown with higher c m n t density over devices previously reprted[3]. The extracted unilateral gain cutsff frequency (fmax) was 75 GHz and the measured current gain cut-off fkquency (ft) was 22GHz. The gate e d drain bias dependence of ft and fmax was measured and will be discussed. [l] [2] [31 *","PeriodicalId":310841,"journal":{"name":"51st Annual Device Research Conference","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High frequency, high breakdown AlInAs/GaInAs junction modulated hemts (JHEMTs) with regrown ohmic contacts by MOCVD\",\"authors\":\"J. Shealy, M. Hashemi, K. Kiziloglu, S. Denbaars, U. Mishra, T.K. Liu, I. Brown, M. Lui\",\"doi\":\"10.1109/DRC.1993.1009632\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"AlInAs/GaInAs High Electron Mobility Transistors excellent high frequency and low noise performance [l]. (HEMTs) have shown However, the power performance of the AlInAdGaInAs channel HEMT has yet to be exploited [2]. The reason is a combination of the lower breakdown voltage in the InGaAs channel and the weak Schottky-barrier height on A M s . On the other hand, the high current densities, due to the large sheet charge density available in the AlInAdGaInAs system make it attractive for millimeter-wave power. Therefore, to optimize the power performance of the AlInAdGaInAs HEMT, the gate barrier height and the breakdown voltage must be improved without sacrificing currcnt density. We present a technology to increase the gatedrain breakdown of AlInAs-GalnAs HEMTs tb record values without substantial impact on other parameters such as Idss and gm. The breakdown in these structures is dependent on the multiplication of electrons injected from the gate (gate leakage) and the source (source cumnt) into the channel. In addition holes are generated by high fields at the drain and arc swept back into the gate and source electrodes. These phenomena can be suppressed by increasing the gate barrier height and alleviating the fields at the drain. In our approach we have achieved both by incorporating a P+ 2DEG junction as the gate which modulates the 2DEG gas and by utilizing a selective regrowth of the some and drain regions by MOCVD. The l p gate-length devices fabricated show a full channel current of 340 “m, transconductance of 240 mS/mm and record high gate-drain breakdown voltage of 3OV (4;~ = l p ) at lmA/mm gate leakage. This is a substantial increase in breakdown with higher c m n t density over devices previously reprted[3]. The extracted unilateral gain cutsff frequency (fmax) was 75 GHz and the measured current gain cut-off fkquency (ft) was 22GHz. The gate e d drain bias dependence of ft and fmax was measured and will be discussed. 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引用次数: 0
摘要
AlInAs/GaInAs高电子迁移率晶体管具有优异的高频和低噪声性能[l]。然而,AlInAdGaInAs通道HEMT的功率性能尚未得到充分利用[2]。其原因是InGaAs通道中较低的击穿电压和a M s上较弱的肖特基势垒高度的结合。另一方面,由于AlInAdGaInAs系统中可用的大片电荷密度,高电流密度使其对毫米波功率具有吸引力。因此,为了优化AlInAdGaInAs HEMT的功率性能,必须在不牺牲电流密度的前提下提高栅极势垒高度和击穿电压。我们提出了一种技术,可以将AlInAs-GalnAs hemt的闸漏击穿提高到记录值,而不会对其他参数(如Idss和gm)产生实质性影响。这些结构中的击穿取决于从栅(栅漏)和源(源计数)注入通道的电子的倍增。此外,漏极处的高电场和电弧扫回栅极和源极会产生空穴。这些现象可以通过增加栅极屏障高度和减轻排水口处的电场来抑制。在我们的方法中,我们通过结合P+ 2DEG结作为调节2DEG气体的栅极,并通过MOCVD利用一些和漏极区域的选择性再生来实现。所制备的lp栅极长器件显示出340”m的全通道电流,240 mS/mm的跨导,在lmA/mm栅极泄漏时记录到3OV (4;~ = l p)的高栅极漏极击穿电压。与先前报道的器件相比,这是一个具有更高cm - n - t密度的击穿大幅增加[3]。提取的单边增益截止频率(fmax)为75 GHz,测量的电流增益截止频率(ft)为22GHz。测量了fmax和fmax的栅极和漏极偏置依赖关系,并将进行讨论。[1] [2] [31]
High frequency, high breakdown AlInAs/GaInAs junction modulated hemts (JHEMTs) with regrown ohmic contacts by MOCVD
AlInAs/GaInAs High Electron Mobility Transistors excellent high frequency and low noise performance [l]. (HEMTs) have shown However, the power performance of the AlInAdGaInAs channel HEMT has yet to be exploited [2]. The reason is a combination of the lower breakdown voltage in the InGaAs channel and the weak Schottky-barrier height on A M s . On the other hand, the high current densities, due to the large sheet charge density available in the AlInAdGaInAs system make it attractive for millimeter-wave power. Therefore, to optimize the power performance of the AlInAdGaInAs HEMT, the gate barrier height and the breakdown voltage must be improved without sacrificing currcnt density. We present a technology to increase the gatedrain breakdown of AlInAs-GalnAs HEMTs tb record values without substantial impact on other parameters such as Idss and gm. The breakdown in these structures is dependent on the multiplication of electrons injected from the gate (gate leakage) and the source (source cumnt) into the channel. In addition holes are generated by high fields at the drain and arc swept back into the gate and source electrodes. These phenomena can be suppressed by increasing the gate barrier height and alleviating the fields at the drain. In our approach we have achieved both by incorporating a P+ 2DEG junction as the gate which modulates the 2DEG gas and by utilizing a selective regrowth of the some and drain regions by MOCVD. The l p gate-length devices fabricated show a full channel current of 340 “m, transconductance of 240 mS/mm and record high gate-drain breakdown voltage of 3OV (4;~ = l p ) at lmA/mm gate leakage. This is a substantial increase in breakdown with higher c m n t density over devices previously reprted[3]. The extracted unilateral gain cutsff frequency (fmax) was 75 GHz and the measured current gain cut-off fkquency (ft) was 22GHz. The gate e d drain bias dependence of ft and fmax was measured and will be discussed. [l] [2] [31 *