无碰撞构建立方体(BBCube) 3D:使用WoW和CoW的异构3D集成，以最低的比特访问能量提供TB/s带宽

2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) Pub Date : 2023-06-11 DOI:10.23919/VLSITechnologyandCir57934.2023.10185277

Norio Chujo, K. Sakui, S. Sugatani, H. Ryoson, Tomoji Nakamura, T. Ohba

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引用次数: 0

摘要

我们提出了一种名为BBCube 3D的技术，用于需要高带宽和高功耗的AI和HPC应用。BBCube 3D是由异构3D集成构建的，其中xPU (CPU, GPU等)小芯片和DRAM晶圆采用无凹凸片和片对片的组合堆叠。BBCube 3D有潜力实现比DDR5高30倍、比HBM2E高4倍的带宽，比特接入能量是DDR5的1/20、HBM2E的1/5。

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Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy

We propose a technology called BBCube 3D for AI and HPC applications, which need high bandwidth and power efficiency. BBCube 3D is constructed by heterogeneous 3D integration in which xPU (CPU, GPU etc.) chiplets and DRAM wafers are stacked using a combination of bumpless Wafer-on-Wafer and Chip-on-Wafer. BBCube 3D has the potential to achieve a bandwidth 30 times higher than DDR5 and four times higher than HBM2E with an bit access energy 1/20th that of DDR5 and 1/5th that of HBM2E.

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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

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