电力电子构件用金属柱互联平行板结构的评价

APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058) Pub Date : 2000-02-06 DOI:10.1109/APEC.2000.826115

Kalyan Siddabattula, Zhou Chen, D. Boroyevich

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引用次数: 19

摘要

本文从布局设计中涉及的寄生元件、电流分布及其对电气性能的影响等方面，对电力电子构件(PEBB)封装方案中采用的金属柱互连并联板结构(MPIPPS)进行了评价。它还将这种技术与更传统的线键技术进行了比较。用实验装置验证了INCA、Maxwell和PSPICE预测的电学性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Evaluation of metal post interconnected parallel plate structure for power electronic building blocks

This paper evaluates metal post interconnected parallel plate structure (MPIPPS) adopted for the power electronic building blocks (PEBB) packaging program in terms of parasitic elements involved in the layout design, current distribution and its impact on electrical performance. It also compares this technology with the more conventional wire-bond technology. Electrical performance predicted by INCA, Maxwell, and PSPICE is verified with an experimental setup.

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APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058)

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