先进SOI装置的辐射效应:对总电离剂量和单事件效应的新见解

M. Gaillardin, M. Raine, P. Paillet, M. Martinez, C. Marcandella, S. Girard, O. Duhamel, N. Richard, F. Andrieu, S. Barraud, O. Faynot
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引用次数: 22

摘要

由于埋藏氧化物提供的介电隔离,SOI技术已经证明了对瞬态辐射效应的内在抵抗力。但是,这种特殊的特性引起了对它们的总电离剂量(TID)敏感性的质疑,特别是在完全耗尽(FD) SOI和多栅极器件中。因此,本文概述了创新SOI器件的辐射效应的最新进展。本文综述了超薄SOI (ETSOI)和FinFET器件中的TID和单事件效应(SEE),以及在纳米级SOI技术中减轻辐射效应的未来挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Radiation effects in advanced SOI devices: New insights into Total Ionizing Dose and Single-Event Effects
The SOI technology has already demonstrated intrinsic resistance to transient radiation effects due to the dielectric isolation provided by the buried oxide. But this special feature raises questions about their Total Ionizing Dose (TID) sensitivity, particularly in Fully Depleted (FD) SOI and multiple-gate devices. This paper thus gives an overview of recent advances in radiation effects on innovative SOI devices. Both TID and Single-Event Effects (SEE) in Extra Thin SOI (ETSOI) and FinFET devices are reviewed as well as upcoming challenges to mitigate radiation effects in nanometer scale SOI technologies.
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