返回通过连接扩展信号链路路径带宽的通过过渡

2008 International Symposium on Electromagnetic Compatibility - EMC Europe Pub Date : 2008-09-01 DOI:10.1109/EMCEUROPE.2008.4786874

Xin Chang, B. Archambeault, M. Cocchini, F. de Paulis, V. Sivarajan, Yaojiang Zhang, J. Fan, S. Connor, A. Orlandi, J. Drewniak

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引用次数: 17

摘要

本文讨论了一种快速准确的方法来评估信号过孔的影响，其中返回电流必须改变参考平面，包括返回电流过孔放置在距离信号过孔不同距离的影响。等效电路包括过通反垫的电容以及空腔效应。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Return via connections for extending signal link path bandwidth of via transitions

This paper discusses a fast and accurate way to assess the impact of signal vias where the return current must change reference planes, including the effect of a return current via placed various distances from the signal via. The equivalent circuit includes capacitance of the via anti-pad as well as cavity effects.

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2008 International Symposium on Electromagnetic Compatibility - EMC Europe

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