ICP-RIE铂(Pt)溅射腐蚀

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2014-09-18 DOI:10.1109/IPFA.2014.6898195

R. Mendaros, M. Marcelo

{"title":"ICP-RIE铂(Pt)溅射腐蚀","authors":"R. Mendaros, M. Marcelo","doi":"10.1109/IPFA.2014.6898195","DOIUrl":null,"url":null,"abstract":"One of the coating materials that is used to reduced electron charging effect during Scanning Electron Microscope (SEM) imaging is Platinum (Pt). Removing Pt coating for parts requiring further electrical testing or deprocessing has been a challenge in failure analysis. This paper discusses the established methodology in removing Pt coating using the ICP-RIE sputter etching technique.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"ICP-RIE Platinum (Pt) sputter etching\",\"authors\":\"R. Mendaros, M. Marcelo\",\"doi\":\"10.1109/IPFA.2014.6898195\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"One of the coating materials that is used to reduced electron charging effect during Scanning Electron Microscope (SEM) imaging is Platinum (Pt). Removing Pt coating for parts requiring further electrical testing or deprocessing has been a challenge in failure analysis. This paper discusses the established methodology in removing Pt coating using the ICP-RIE sputter etching technique.\",\"PeriodicalId\":409316,\"journal\":{\"name\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"51 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-09-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2014.6898195\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898195","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

在扫描电子显微镜(SEM)成像中，用于降低电子充电效应的涂层材料之一是铂(Pt)。在故障分析中，去除需要进一步电气测试或去加工的部件的铂涂层一直是一个挑战。本文讨论了采用ICP-RIE溅射蚀刻技术去除Pt涂层的既定方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

ICP-RIE Platinum (Pt) sputter etching

One of the coating materials that is used to reduced electron charging effect during Scanning Electron Microscope (SEM) imaging is Platinum (Pt). Removing Pt coating for parts requiring further electrical testing or deprocessing has been a challenge in failure analysis. This paper discusses the established methodology in removing Pt coating using the ICP-RIE sputter etching technique.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

自引率

0.00%

发文量