厚层背面对准技术在先进功率器件制造中的应用

The 17th Annual SEMI/IEEE ASMC 2006 Conference Pub Date : 2006-05-22 DOI:10.1109/ASMC.2006.1638732

Jung Kil Lee, R. Chisholm, M. V. D. van der Heijden, K. Best, P. Berge

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引用次数: 1

摘要

在生产先进功率器件的厚层工艺流程中实现了背面对准。讨论了背面对准方案的对准和覆盖性能，以及在生产率和降低成本方面的好处

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Application of Back-side Alignment of Thick Layers for the Manufacturing of Advanced Power Devices

Back-side alignment was implemented in the thick layer process flow for the production of advanced power devices. The alignment and overlay performance of the back-side alignment scheme are addressed, as well as the benefits in terms of productivity and cost reduction

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The 17th Annual SEMI/IEEE ASMC 2006 Conference

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