封装微机械麦克风的封装诱发应力

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI:10.1109/ISAPM.1998.664454

O. Rusanen, A. Torkkeli, J. Vahakangas

{"title":"封装微机械麦克风的封装诱发应力","authors":"O. Rusanen, A. Torkkeli, J. Vahakangas","doi":"10.1109/ISAPM.1998.664454","DOIUrl":null,"url":null,"abstract":"The emergence of micromechanical components and systems offers a viable step towards miniaturisation of electronics products. VTT Electronics has developed a capacitive microphone that is manufactured using silicon micromachining. Die bonding to silicon substrate has shown to inflict only minor stresses to the microphone performance when an elastic silicone adhesive is used. Flip chip bonding will increase the amount of stresses, especially if the substrate material is not matched to silicon in its thermal expansion.","PeriodicalId":354229,"journal":{"name":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Packaging induced stresses in a packaged micromechanical microphone\",\"authors\":\"O. Rusanen, A. Torkkeli, J. Vahakangas\",\"doi\":\"10.1109/ISAPM.1998.664454\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The emergence of micromechanical components and systems offers a viable step towards miniaturisation of electronics products. VTT Electronics has developed a capacitive microphone that is manufactured using silicon micromachining. Die bonding to silicon substrate has shown to inflict only minor stresses to the microphone performance when an elastic silicone adhesive is used. Flip chip bonding will increase the amount of stresses, especially if the substrate material is not matched to silicon in its thermal expansion.\",\"PeriodicalId\":354229,\"journal\":{\"name\":\"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAPM.1998.664454\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.1998.664454","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

微机械部件和系统的出现为电子产品的小型化提供了可行的一步。VTT Electronics开发了一种使用硅微加工制造的电容式麦克风。当使用弹性硅酮胶粘剂时，硅基板的粘接对麦克风性能的影响很小。倒装芯片键合会增加应力量，特别是如果衬底材料在热膨胀中与硅不匹配。

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Packaging induced stresses in a packaged micromechanical microphone

The emergence of micromechanical components and systems offers a viable step towards miniaturisation of electronics products. VTT Electronics has developed a capacitive microphone that is manufactured using silicon micromachining. Die bonding to silicon substrate has shown to inflict only minor stresses to the microphone performance when an elastic silicone adhesive is used. Flip chip bonding will increase the amount of stresses, especially if the substrate material is not matched to silicon in its thermal expansion.

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Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)

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