K. Kikuchi, J. Sakai, K. Soejima, Shinya Funato, M. Kawano, H. Kouta, S. Yamamichi
{"title":"采用双厚聚合物技术实现适合高速数据传输的低信号垫电容","authors":"K. Kikuchi, J. Sakai, K. Soejima, Shinya Funato, M. Kawano, H. Kouta, S. Yamamichi","doi":"10.1109/IITC.2009.5090348","DOIUrl":null,"url":null,"abstract":"A Pad-on-Stacked-Polymer (PASPO) technology, based on low cost packaging process, has been developed by utilizing 13-µm-thick double polymer layers and modified signal land design. The bottom photosensitive polymer shows higher via-hole resolution and higher chemical tolerance than conventional passivation polymer. The highly-reliable top polymer is planarized by CMP. For the 20-µm-square signal land, the PASPO technology drastically reduces the signal pad capacitance from 173 fF to 11 fF, and a clear eye opening for 40 Gbps signal transmission has been achieved for the low-k test chip.","PeriodicalId":301012,"journal":{"name":"2009 IEEE International Interconnect Technology Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Double thick-polymer technology to realize low signal pad capacitance suitable for high-speed data transmission\",\"authors\":\"K. Kikuchi, J. Sakai, K. Soejima, Shinya Funato, M. Kawano, H. Kouta, S. Yamamichi\",\"doi\":\"10.1109/IITC.2009.5090348\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A Pad-on-Stacked-Polymer (PASPO) technology, based on low cost packaging process, has been developed by utilizing 13-µm-thick double polymer layers and modified signal land design. The bottom photosensitive polymer shows higher via-hole resolution and higher chemical tolerance than conventional passivation polymer. The highly-reliable top polymer is planarized by CMP. For the 20-µm-square signal land, the PASPO technology drastically reduces the signal pad capacitance from 173 fF to 11 fF, and a clear eye opening for 40 Gbps signal transmission has been achieved for the low-k test chip.\",\"PeriodicalId\":301012,\"journal\":{\"name\":\"2009 IEEE International Interconnect Technology Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE International Interconnect Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2009.5090348\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE International Interconnect Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2009.5090348","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Double thick-polymer technology to realize low signal pad capacitance suitable for high-speed data transmission
A Pad-on-Stacked-Polymer (PASPO) technology, based on low cost packaging process, has been developed by utilizing 13-µm-thick double polymer layers and modified signal land design. The bottom photosensitive polymer shows higher via-hole resolution and higher chemical tolerance than conventional passivation polymer. The highly-reliable top polymer is planarized by CMP. For the 20-µm-square signal land, the PASPO technology drastically reduces the signal pad capacitance from 173 fF to 11 fF, and a clear eye opening for 40 Gbps signal transmission has been achieved for the low-k test chip.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
