{"title":"高密度，高性能MCM-D/C封装:设计，电气和工艺的角度","authors":"M. Ellsworth, H. Hamel, E. Perfecto, T. Wassick","doi":"10.1109/ECTC.1996.550503","DOIUrl":null,"url":null,"abstract":"This paper describes a state-of-the-art seven chip MCM-D/C package currently under production for use as a processor module for the high end of IBM's AS/400 Advanced Series with PowerPC technology. Physical design, process, and electrical design (characterization) is described, and trade-offs made between them are discussed.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"47 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"A high density, high performance MCM-D/C package: a design, electrical, and process perspective\",\"authors\":\"M. Ellsworth, H. Hamel, E. Perfecto, T. Wassick\",\"doi\":\"10.1109/ECTC.1996.550503\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes a state-of-the-art seven chip MCM-D/C package currently under production for use as a processor module for the high end of IBM's AS/400 Advanced Series with PowerPC technology. Physical design, process, and electrical design (characterization) is described, and trade-offs made between them are discussed.\",\"PeriodicalId\":143519,\"journal\":{\"name\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"volume\":\"47 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1996.550503\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 Proceedings 46th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1996.550503","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A high density, high performance MCM-D/C package: a design, electrical, and process perspective
This paper describes a state-of-the-art seven chip MCM-D/C package currently under production for use as a processor module for the high end of IBM's AS/400 Advanced Series with PowerPC technology. Physical design, process, and electrical design (characterization) is described, and trade-offs made between them are discussed.
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