芯片功耗模型——系统功耗完整性分析与设计的新方法

E. Kulali, E. Wasserman, Ji Zheng
{"title":"芯片功耗模型——系统功耗完整性分析与设计的新方法","authors":"E. Kulali, E. Wasserman, Ji Zheng","doi":"10.1109/EPEP.2007.4387176","DOIUrl":null,"url":null,"abstract":"A compact SPICE equivalent circuit model of full-chip power network is proposed in this paper to address the system power integrity co-design and optimization. The theory and procedures for the generation of the compact chip power model is described. The accuracy validation of the chip power model is also presented.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"34","resultStr":"{\"title\":\"Chip Power Model - A New Methodology for System Power Integrity Analysis and Design\",\"authors\":\"E. Kulali, E. Wasserman, Ji Zheng\",\"doi\":\"10.1109/EPEP.2007.4387176\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A compact SPICE equivalent circuit model of full-chip power network is proposed in this paper to address the system power integrity co-design and optimization. The theory and procedures for the generation of the compact chip power model is described. The accuracy validation of the chip power model is also presented.\",\"PeriodicalId\":402571,\"journal\":{\"name\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"34\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2007.4387176\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387176","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 34

摘要

为了解决全芯片电网电源完整性协同设计与优化问题,提出了一种紧凑的SPICE等效电路模型。介绍了小型芯片功率模型生成的理论和步骤。最后对芯片功耗模型的精度进行了验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Chip Power Model - A New Methodology for System Power Integrity Analysis and Design
A compact SPICE equivalent circuit model of full-chip power network is proposed in this paper to address the system power integrity co-design and optimization. The theory and procedures for the generation of the compact chip power model is described. The accuracy validation of the chip power model is also presented.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信