使用软基板的40 ghz平台

2016 31st Symposium on Microelectronics Technology and Devices (SBMicro) Pub Date : 2016-08-01 DOI:10.1109/SBMICRO.2016.7731349

C. Finardi, A. F. Ponchet, C. B. Adamo, R. C. Teixeira, R. Panepucci, A. Flacker

{"title":"使用软基板的40 ghz平台","authors":"C. Finardi, A. F. Ponchet, C. B. Adamo, R. C. Teixeira, R. Panepucci, A. Flacker","doi":"10.1109/SBMICRO.2016.7731349","DOIUrl":null,"url":null,"abstract":"The paper presents a technological solution for high frequency packaging platform to at least 40 GHz. This approach is based on soft substrate processing. We present results of high frequency packaging of important building blocks, such as bias-T, transimpedance amplifiers. The paper demonstrates a solution for high-frequency hybridization that can be implemented with standard substrates.","PeriodicalId":113603,"journal":{"name":"2016 31st Symposium on Microelectronics Technology and Devices (SBMicro)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A 40 GHz-platform using soft substrates\",\"authors\":\"C. Finardi, A. F. Ponchet, C. B. Adamo, R. C. Teixeira, R. Panepucci, A. Flacker\",\"doi\":\"10.1109/SBMICRO.2016.7731349\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper presents a technological solution for high frequency packaging platform to at least 40 GHz. This approach is based on soft substrate processing. We present results of high frequency packaging of important building blocks, such as bias-T, transimpedance amplifiers. The paper demonstrates a solution for high-frequency hybridization that can be implemented with standard substrates.\",\"PeriodicalId\":113603,\"journal\":{\"name\":\"2016 31st Symposium on Microelectronics Technology and Devices (SBMicro)\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 31st Symposium on Microelectronics Technology and Devices (SBMicro)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SBMICRO.2016.7731349\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 31st Symposium on Microelectronics Technology and Devices (SBMicro)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SBMICRO.2016.7731349","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

提出了一种40 GHz以上高频封装平台的技术方案。这种方法是基于软基板加工。我们介绍了高频封装的重要组成部分，如偏置- t，跨阻放大器的结果。本文演示了一种可以在标准衬底上实现高频杂交的解决方案。

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A 40 GHz-platform using soft substrates

The paper presents a technological solution for high frequency packaging platform to at least 40 GHz. This approach is based on soft substrate processing. We present results of high frequency packaging of important building blocks, such as bias-T, transimpedance amplifiers. The paper demonstrates a solution for high-frequency hybridization that can be implemented with standard substrates.

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来源期刊

2016 31st Symposium on Microelectronics Technology and Devices (SBMicro)

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