{"title":"栅极全能GaSb/InAs纳米线tfet的快速全频带模式空间NEGF模型原子模拟","authors":"A. Afzalian, M. Passlack, Y. Yeo","doi":"10.1109/VLSI-TSA.2016.7480492","DOIUrl":null,"url":null,"abstract":"Atomistic device simulations are presented to assess the potential of InAs/GaSb GAA NW n- and p-TFETs with diameter d of 5.45 nm. Using a recent breakthrough in atomistic modeling, more than 100× reduction in simulation time was achieved using a tight binding mode-space approach. This enabled full-band transport simulation for a device with ~100,000 atoms, employing an accurate sp3s*SO (10 orbitals/atom) tight binding basis. At IOFF of 10 pA/μm, an optimized n-TFET with a pocket region is predicted to have ION of 46 and 196 μA/μm at VDD of 0.3, and 0.5 V, respectively. This achieves a better energy-delay product than its MOSFET counterpart. Through careful design, similar performance can be achieved for p- and n- TFETs.","PeriodicalId":441941,"journal":{"name":"2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","volume":"87 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Atomistic simulation of gate-all-around GaSb/InAs nanowire TFETs using a fast full-band mode-space NEGF model\",\"authors\":\"A. Afzalian, M. Passlack, Y. Yeo\",\"doi\":\"10.1109/VLSI-TSA.2016.7480492\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Atomistic device simulations are presented to assess the potential of InAs/GaSb GAA NW n- and p-TFETs with diameter d of 5.45 nm. Using a recent breakthrough in atomistic modeling, more than 100× reduction in simulation time was achieved using a tight binding mode-space approach. This enabled full-band transport simulation for a device with ~100,000 atoms, employing an accurate sp3s*SO (10 orbitals/atom) tight binding basis. At IOFF of 10 pA/μm, an optimized n-TFET with a pocket region is predicted to have ION of 46 and 196 μA/μm at VDD of 0.3, and 0.5 V, respectively. This achieves a better energy-delay product than its MOSFET counterpart. Through careful design, similar performance can be achieved for p- and n- TFETs.\",\"PeriodicalId\":441941,\"journal\":{\"name\":\"2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)\",\"volume\":\"87 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-04-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSI-TSA.2016.7480492\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI-TSA.2016.7480492","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Atomistic simulation of gate-all-around GaSb/InAs nanowire TFETs using a fast full-band mode-space NEGF model
Atomistic device simulations are presented to assess the potential of InAs/GaSb GAA NW n- and p-TFETs with diameter d of 5.45 nm. Using a recent breakthrough in atomistic modeling, more than 100× reduction in simulation time was achieved using a tight binding mode-space approach. This enabled full-band transport simulation for a device with ~100,000 atoms, employing an accurate sp3s*SO (10 orbitals/atom) tight binding basis. At IOFF of 10 pA/μm, an optimized n-TFET with a pocket region is predicted to have ION of 46 and 196 μA/μm at VDD of 0.3, and 0.5 V, respectively. This achieves a better energy-delay product than its MOSFET counterpart. Through careful design, similar performance can be achieved for p- and n- TFETs.