采用三井结构的先进SEU工程[CMOS SRAM]

H. Puchner, Y.Z. Xu, D. Radaelli
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引用次数: 1

摘要

在18mbit快速同步SRAM上实现了三井方案,并通过高能注入来评估其对α粒子诱导加速软误差率(ASER)的影响。该器件采用单多晶硅,0.15 /spl μ m CMOS工艺。测试车辆的SEU性能表明,只有通过合理的井设计才能实现三井隔离的优势和更好的SEU性能。在NMOS和PMOS地区,三井方案需要进行权衡。一般来说,它在NMOS区域得到改善,但在PMOS区域由于PMOS区域孔的收集量增加而下降。三井结构的有效性取决于平衡井设计和出井方案之间的权衡。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Advanced SEU engineering using a triple well architecture [CMOS SRAM]
A triple well scheme has been implemented on an 18 Mbit fast synchronous SRAM by using a high energy implant to evaluate its impact on the alpha-particle induced accelerated soft error rate (ASER). The device uses a single poly, 0.15 /spl mu/m CMOS process. The SEU performance of the test vehicle shows that the advantage of the triple well isolation and better SEU performance can only be achieved by a proper design of the wells. There is a trade off in the NMOS and PMOS region for the triple well scheme. In general, it improves in the NMOS area but degrades in the PMOS area due to the increased collection volume for holes in the PMOS area. The effectiveness of the triple well architecture depends on balancing the well design and tapping scheme trade offs.
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