214ghz下180mW InP HBT功率放大器MMIC

T. Reed, Z. Griffith, P. Rowell, M. Field, M. Rodwell
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引用次数: 41

摘要

演示了一种固态功率放大器MMIC,在214GHz下,从非薄芯片获得180mW的饱和输出功率,信号S21增益为22.0dB。3db带宽从210GHz以下扩展到230GHz。配电柜为12.9W。PA Cell设计采用250nm InP HBT工艺和新颖的三端口调谐网络。在5μm BCB微带中采用三级片上功率组合,在功率放大器MMIC中组合了16个PA单元。结果是输出外围比之前最先进的InP HBT功率放大器mmic设计的220GHz增加了4倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 180mW InP HBT Power Amplifier MMIC at 214 GHz
A solid state power amplifier MMIC is demonstrated with 180mW of saturated output power at 214GHz, from an unthinned die, and a small signal S21 gain of 22.0dB. 3-dB bandwidth extends from below 210GHz to 230GHz. PDC is 12.9W. PA Cell design uses a 250nm InP HBT process and a novel three-port tuning network. Three levels of on-wafer power combining in 5μm BCB microstrip are used to combine 16 PA cells in a power amplifier MMIC. The result is a 4x increase in output periphery versus the previous state-of-the-art for InP HBT power amplifier MMICs designed for 220GHz.
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