用于CDMA手机应用的功率放大器的热特性

Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005. Pub Date : 2005-03-15 DOI:10.1109/STHERM.2005.1412179

T. Nozu

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引用次数: 1

摘要

基于直流测量和三维有限元建模，证明了用于CDMA手机的InGaP/GaAs HBT功率放大器的热特性，从而使该问题中的非均匀热流处理成为可能。对导电胶粘剂在实际功放环境下的性能进行了评价。将包括接触热阻在内的有限元模型应用于具有不同射极指数的hbt，得到了与测量值较好的吻合。对于高导热的胶粘剂，发现功率放大器总热阻的1/3可归因于GaAs/胶粘剂/散热器粘合线周围的接触热阻，而体热贡献可以忽略不计。

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Thermal characterization of power amplifiers for CDMA cellular phone applications

Thermal characterization of InGaP/GaAs HBT power amplifiers for CDMA cellular phone handsets has been demonstrated on the basis of DC measurements of the HBTs and 3D finite element modeling, which made the treatment of non-uniform heat flow in this problem possible. Evaluation of conductive adhesives in the actual power amplifier environment has also been carried out. The finite element modeling including thermal contact resistance was applied to the HBTs with various numbers of emitter fingers and good agreement with measurements was obtained. For an adhesive with a high thermal conductance, it was found that 1/3 of the total thermal resistance of the power amplifier was attributable to the contact thermal resistance around GaAs/adhesive/heat sink bond line and that the bulk thermal contribution was negligible.

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Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.

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