{"title":"金属辅助化学垂直蚀刻硅:催化剂形态和氧化剂浓度的影响","authors":"B. Deepu, Sangeeth Kallat, A. Suresh, P. Savitha","doi":"10.1109/ICEMELEC.2014.7151184","DOIUrl":null,"url":null,"abstract":"Deep vertical etching of Si using hydrogen peroxide as oxidant and Au as catalyst has been studied in terms of relative reactant concentrations and catalyst morphology. The concentrations of hydrogen peroxide and hydrofluoric acid are highly important and the ratio of the same can be varied to achieve isotropic to highly anisotropic vertical etching. Catalyst morphology and positioning of the substrate was also seen to affect vertical etch profiles, with high catalyst deposition rates and horizontal placement of the sample giving deep etching without defects.","PeriodicalId":186054,"journal":{"name":"2014 IEEE 2nd International Conference on Emerging Electronics (ICEE)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Metal-assisted chemical vertical etching of Si: Effect of catalyst morphology and oxidant concentration\",\"authors\":\"B. Deepu, Sangeeth Kallat, A. Suresh, P. Savitha\",\"doi\":\"10.1109/ICEMELEC.2014.7151184\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Deep vertical etching of Si using hydrogen peroxide as oxidant and Au as catalyst has been studied in terms of relative reactant concentrations and catalyst morphology. The concentrations of hydrogen peroxide and hydrofluoric acid are highly important and the ratio of the same can be varied to achieve isotropic to highly anisotropic vertical etching. Catalyst morphology and positioning of the substrate was also seen to affect vertical etch profiles, with high catalyst deposition rates and horizontal placement of the sample giving deep etching without defects.\",\"PeriodicalId\":186054,\"journal\":{\"name\":\"2014 IEEE 2nd International Conference on Emerging Electronics (ICEE)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE 2nd International Conference on Emerging Electronics (ICEE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEMELEC.2014.7151184\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE 2nd International Conference on Emerging Electronics (ICEE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEMELEC.2014.7151184","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Metal-assisted chemical vertical etching of Si: Effect of catalyst morphology and oxidant concentration
Deep vertical etching of Si using hydrogen peroxide as oxidant and Au as catalyst has been studied in terms of relative reactant concentrations and catalyst morphology. The concentrations of hydrogen peroxide and hydrofluoric acid are highly important and the ratio of the same can be varied to achieve isotropic to highly anisotropic vertical etching. Catalyst morphology and positioning of the substrate was also seen to affect vertical etch profiles, with high catalyst deposition rates and horizontal placement of the sample giving deep etching without defects.