拆分制造对电源需求的影响

Sharath K. Rangan, Shazia Afreen, R. Srinivasan
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引用次数: 0

摘要

拆分制造已成为有效控制恶意软件插入和IP盗版的重要手段之一。3D集成电路技术仍处于起步阶段,但目前大多数制造工厂都采用2.5D集成电路技术。虽然最近对分裂制造的研究主要集中在图论算法上,以实现最小的切割分裂,但没有人讨论过分裂对电路性能的影响。在本文中,我们表明分裂制造对电源需求有不利影响,如果电路性能指标必须在分裂前后保持相同。特别是,我们已经表明,如果电路性能指标必须在分裂过程之前和之后得到满足,则需要多个电源。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of split manufacturing on power supply requirements
Split manufacturing has become one of the most important methods to effectively control malware insertion and IP piracy. 3D IC technologies are still in the nascent stage, but 2.5D IC technology is currently adopted by most fabrication facilities. While recent studies on split manufacturing have focused on graph theoretic algorithms to effect a minimum cut split, none of them have discussed the effect of circuit performance due to the splitting. In this paper we show that split manufacturing has an adverse effect on power supply requirement, if circuit performance metrics have to stay the same before and after splitting. In particular, we have shown that multiple power supplies are necessary if circuit performance metrics have to be satisfied before and after the splitting procedure.
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